PCIe 3.0/3.1/USB3.0/SATA3 Combo PHY TSMC 22ULP/ULL
The PHY module includes a top level wrapper integrating both the Physical Media Attachment (PMA) layer, and the Physical Coding Sub-Block (PCS) layer.
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PCIe3.0 IP
- Single Lane and Quad Lane 8Gbps PCIe3.0 PHY IP in TSMC 28HPC process
- Single Lane and Quad Lane 8Gbps PCIe3.0 PHY IP in GF 28SLP process
- Single Lane and Quad Lane 8Gbps PCIe3.0 PHY in Samsung 28LPP process
- Single Lane and Quad Lane 8Gbps PCIe3.0 PHY IP in TSMC 65G process
- USB 3.0/ PCIe 3.0/ SATA 3.0 Combo PHY IP, Silicon Proven in SMIC 14SF+
- 8G Multi-SerDes For PCIe3.0/USB3.0 PHY