OPENEDGES, the memory system IP provider, including DDR memory controller, DDR PHY, on-chip interconnect, and NPU IP together as an integrated solution or independent IP. They are tightly combined ...

High-performance IP for graphics, AI/ML, and automotive products The latest, the Denali PHY IP for GDDR6, is comprised of architectural improvements drawn from previous-generation DDR ...

Innosilicon GDDR6/6X Combo IP is fully compliant to the JEDEC GDDR6/6X standard, supporting up to 16Gbps per pin for PAM2 GDDR6 and 21Gbps for PAM4 GDDR6X. The GDDR6/6X interface supports 2 ...

High-performance IP for graphics, AI/ML, and automotive products The latest, the Denali PHY IP for GDDR6, is comprised of architectural improvements drawn from previous-generation DDR ...

Designed for high performance and low latency in AI/ML, graphics and networking The latest, the Denali PHY IP for GDDR6, is comprised of architectural improvements drawn from previous-generation ...

Designed for high performance and low latency in AI/ML, graphics and networking The latest, the Denali PHY IP for GDDR6, is comprised of architectural improvements drawn from previous-generation ...

Rambus GDDR6 控制器核心设计用于需要高内存吞吐量的应用，包括图像处理、高级驱动器辅助系统 (ADAS)、数据中心和人工智能 (AI)。Rambus GDDR6 PHY 包含完整的 GDDR6 内存接口子系...

1 Testimonial
Serge Leef, Microsystems Technology Office Program Manager, DARPA

OPENEDGES, the memory system IP provider, including DDR memory controller, DDR PHY, on-chip interconnect, and NPU IP together as an integrated solution or independent IP. They are tightly combined ...

The LPDDR5X/5/4X/4 combo PHY IP features a state-of-art mixed-signal architecture that addresses the challenges of DRAM integration in high-performance and low-power environments. This architecture ...

The LPDDR5X/5/4X/4 combo PHY IP features a state-of-art mixed-signal architecture that addresses the challenges of DRAM integration in high-performance and low-power environments. This architecture ...

The LPDDR5X/5/4X/4 combo PHY IP features a state-of-art mixed-signal architecture that addresses the challenges of DRAM integration in high-performance and low-power environments. This architecture ...

The third-generation HBM (HBM3/2E) technology, outlined by the JESD235C standard, inherits physical 128-bit DDR interface with 2n/4n prefetch architecture, internal organization, 1024-bit input/output, ...

Innosilicon can provide different Die2Die solution for customer depend on package type, Following is Innosilicon Die2Die IP family: Innolink-A, Serdes base, up to 32/56Gbps/pair, long reach, ...

Innosilicon GDDR7 PHY is fully compliant to the JEDEC GDDR7 standard, supporting up to 32Gbps for PAM3 GDDR7. In pam3 mode, the byte consists of ten DQ and one DQE signals, the GDDR7 also supports ...

HBM2E PHY 专为AI/ML、HPC的性能和低延迟而设计，数据中心和图形应用程序。 HBM 是一款高性能内存，特点是功耗低、尺寸小。它以更低的时钟速度（与 GDDR6 相比）将 2.5D 封装与...

3 Testimonials
Jongshin Shin, Vice President of Design Platform Development, Samsung Electronics