The Alphawave DieCORE delivers the world’s highest density, lowest power die-to-die connectivity solution for MCMs based on IEEE XSR/USR serial standards.
The DieCORE is a companion IP to the AlphaCORE LR IP, for large datacenter SOCs that are moving to multi-chiplet MCM products based on organic substrates or Silicon interposers. The DieCORE allows signals to be transferred across chiplets with sub-mW/Gbps power consumption, and at an IO density of over 1Tbps per millimeter of Silicon.
- High speed performance
- DieCORE employs a low noise, high speed analog front end that delivers performance and configurability to support both PAM4 and NRZ signalling.
- Low power architecture
- DieCORE operates at sub-mW/Gbps power consumption, while still providing robust 8-10dB of equalization for both chiplet and optical interface.
- Tracking CDR
- DieCORE operates with a continuously tracking CDR that provides robust data recovery in large MCMs across process, voltage and temperature.
- Industry standard support
- DieCORE eliminates the need for costly proprietary interface solutions by delivering high density low power support for both XSR and USR IEEE and OIF standards.
- Receive Equalization
- DieCORE has been co-optimized to provide robust, low power equalization for die-die applications.
- IO Density
- DieCORE delivers a world-leading 1Tbps of IO density per millimeter of Silicon.
- Supports 1, 4, 8, 16 lane configurations, different IP options available for north/south versus east/west orientations. DieCORE also supports multiple rows of stacking for ultra-high density chiplet applications, and can also support multiple different metal options for SOC flexibility.
- Devices Used
- Standard CMOS digital devices.
Block Diagram of the 25-112Gbps Short-Reach PHY