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USB 2.0 femtoPHY in UMC (28nm)
The Synopsys DesignWare® USB 2.0 femtoPHY provides designers with a complete physical (PHY) layer IP solution for low-power mobile and consumer applications such as smartphones, tablets, digital TVs, and media players. Offering reduced silicon cost and longer battery life, the DesignWare USB 2.0 femtoPHY IP delivers 50% smaller die area and minimizes active and suspend power consumption.
The DesignWare USB 2.0 femtoPHY implements the latest USB battery charger version 1.2 and USB On-The-Go (OTG) version 2.0 specifications from the USB Implementer’s Forum (USB-IF).
Architected for the industry’s most advanced 1.8V process technologies, the USB 2.0 femtoPHY is designed with features created to minimize effects due to variations in foundry process, device models, packages, and board parasitics.
The DesignWare USB 2.0 femtoPHY builds on years of customer success with Synopsys’ silicon-proven USB PHY IP product line, which has been ported to over 100 process nodes and configuration combinations ranging from 180-nm to 14-nm. When combined with the DesignWare Host, Device or On-The-Go (OTG) digital controllers and verification IP, the DesignWare USB 2.0 femtoPHY delivers a complete low power and small die area solution for advanced system-on-chip (SoC) designs.
The DesignWare USB 2.0 femtoPHY implements the latest USB battery charger version 1.2 and USB On-The-Go (OTG) version 2.0 specifications from the USB Implementer’s Forum (USB-IF).
Architected for the industry’s most advanced 1.8V process technologies, the USB 2.0 femtoPHY is designed with features created to minimize effects due to variations in foundry process, device models, packages, and board parasitics.
The DesignWare USB 2.0 femtoPHY builds on years of customer success with Synopsys’ silicon-proven USB PHY IP product line, which has been ported to over 100 process nodes and configuration combinations ranging from 180-nm to 14-nm. When combined with the DesignWare Host, Device or On-The-Go (OTG) digital controllers and verification IP, the DesignWare USB 2.0 femtoPHY delivers a complete low power and small die area solution for advanced system-on-chip (SoC) designs.
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Video Demo of the USB 2.0 femtoPHY in UMC (28nm)
USB 2.0 has been around for over 20 years and is the world's most popular wired interconnect standard. Join Morten Christiansen and Gervais Fong as they discuss how the new eUSB2 standard enables USB 2.0 connectivity for SoCs in the most advanced process nodes.