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Super Inductor IP

Presently, stacked metal baluns and inductors exist on many processes, but are limited in performance by the forced use of lower process metal with high resistances and capacitances. The RF performance of the CC-203IP is greatly enhanced, in terms of Q and frequency response, extending the capabilities of SoC designs using stacked layer techniques, pioneered by CurrentRF. These newly-pioneered on-chip layer stacking techniques reduce the physical x-y size of the CC-203 super inductor, aiding in Q enhancement and frequency response.