You are here:
PAD - SMIC 110nm generic
特色
- Standard I/O size is low to 78um*32um
- HBM ESD: ±2000V; MM: ±200V; CDM: ±500V; LU: 150mA
查看 PAD - SMIC 110nm generic 详细介绍:
- 查看 PAD - SMIC 110nm generic 完整数据手册
- 联系 PAD - SMIC 110nm generic 供应商
PAD IP
- A 28nm Wirebond IO library with dynamically switchable 1.8V/ 3.3V GPIO, 5V I2C open-drain, 1.8V & 3.3V analog, OTP program cell, and HDMI & LVDS protection macros - featured across a variety of metal stack and pad configuration options
- LVDS IO Pad Set
- RF I/O Pad Set and Discrete RF ESD Protection Components
- DDR3_DDR4 IO Pad Set
- SSTL_15 / SSTL_18 Combo I/O Pad Set
- I2C IO Pad Set