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MIPI D-PHY in TSMC for Automotive (28nm, 16nm)
The demand for advanced multimedia features is pushing device manufacturers to integrate more advanced peripherals such as multi-megapixel cameras and larger screens. Integrating these capabilities into next-generation devices brings new challenges to the industry in terms of power, time-to-market and overall system costs.
To address these challenges, the Mobile Industry Processor Interface (MIPI®) Alliance defines and promotes open interface specifications, such as the Camera Serial Interface (CSI-2), Display Serial Interface (DSI), which all use the MIPI D-PHY.
As a leading provider of interface IP, Synopsys’ high-quality, silicon-proven DesignWare D-PHY IP is available today in advanced process technologies.
To address these challenges, the Mobile Industry Processor Interface (MIPI®) Alliance defines and promotes open interface specifications, such as the Camera Serial Interface (CSI-2), Display Serial Interface (DSI), which all use the MIPI D-PHY.
As a leading provider of interface IP, Synopsys’ high-quality, silicon-proven DesignWare D-PHY IP is available today in advanced process technologies.
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