LZ4 compression and decompression IP core
NVM Anti-Fuse OTP NeoFuse in UMC (110nm, 80nm, 55nm, 40nm, 28nm, 22nm)
LPDDR5/4/4X PHY in TSMC (16nm, 12nm, N7, N6, N5)
Thermal Diode for fast and coarse temperature measurement
神盾旗下乾瞻科技加入英特尔晶圆代工加速器IP联盟 共同推动半导体设计流程
GUC 宣布成功推出业界首款采用台积电 3nm 和 CoWoS 技术的 UCIe 32G 芯片
Semidynamics 的 Aliado SDK 通过无缝集成 ONNX 加速 RISC-V 的人工智能开发
Density Management in Analog Layout Design: Addressing Issues and Ensuring Consistency
How the Ability to Manage Register Specifications Helps You Create More Competitive Products
Why RISC-V is a viable option for safety-critical applications
RISC-V Powered Executive M.Tech VLSI PG Program for Next-Gen Chip Designers
Rambus CryptoManager Root of Trust Solutions Tailor Security Capabilities to Specific Customer Needs with New Three-Tier Architecture
Arm Kleidi Arrives in Automotive Markets to Accelerate Performance for AI-based Applications
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