USB 3.2 Gen2/Gen1 PHY IP in TSMC(5nm, 6nm, 7nm,12nm/16nm, 22nm, 28nm, 40nm, 55nm)
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General Purpose Multi-Voltage IO IP, BOAC (Bonding Over Active Circuit), UMC 0.13um LL/FSG process
UMC 0.13um LL/FSG process, Multi-Voltage BOAC mini IO.
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