You are here:
General Purpose IO IP, BOAC (Bonding Over Active Circuit), UMC 90nm LL process
UMC 90nm LL/RVT process true 3.3V standard IO (using 3.3V gate oxide).
查看 General Purpose IO IP, BOAC (Bonding Over Active Circuit), UMC 90nm LL process 详细介绍：
- 查看 General Purpose IO IP, BOAC (Bonding Over Active Circuit), UMC 90nm LL process 完整数据手册
- 联系 General Purpose IO IP, BOAC (Bonding Over Active Circuit), UMC 90nm LL process 供应商
GPIO IP
- APB4 General Purpose Input/Output Module
- A 22nm Wirebond IO library with dynamically switchable 1.8V/3.3V GPIO, 3.3V I2C open-drain, & analog cells
- A 65nm Wirebond IO library with 1-3.3V GPIO, 3.3V pulse-width modulation cell, I2C & SVID open-drain, 3.3V & 5V analog and OTP program cell
- A 130nm Wirebond IO library with 3.3V GPIO, LVDS TX & RX, 3.3V I2C open-drain, analog cell and OTP program cell
- A 180nm Flip-Chip IO library with 1.2-1.8V GPIO, 1.8V & 5V analog/RF, 20-36V ultra-low leakage low-cap HV analog and OTP program cell
- A 65nm Wirebond IO library with 2.5V GPIO, LVDS TX & RX and 2.5V analog / RF