MIPI C-PHY v1.2 D-PHY v2.1 RX 3 trios/4 Lanes in TSMC (16nm, 12nm, N7, N6, N5)
You are here:
Die-to-Die (D2D) Interconnect
Lightweight die-to-die interconnect solution optimized for highest performance with the lowest power and area overhead
查看 Die-to-Die (D2D) Interconnect 详细介绍：
- 查看 Die-to-Die (D2D) Interconnect 完整数据手册
- 联系 Die-to-Die (D2D) Interconnect 供应商