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DDR3/DDR2/LPDDR2 COMBO Interface
特色
- DDR3/DDR2/LPDDR2 COMBO interface for DRAM application
- SMIC 40nm Logic Low Leakage Salicide 1.1V/1.8V/2.5V Process
- Cell Size (Width * height) 30um * 280um with DUP stagger bonding pads
- Work IO voltage: 1.2V/1.5V/1.8V
- Programmable driven-strength, programmable ODT,support DDR3-1333,DDR2-1066,LPDDR2-1066
- Suitable for 8 layer application
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IO IP
- TSMC 12 FFC Combo Power On Reset_POR_COMBO, IO voltage=1.8V / Core voltage=0.8V
- TSMC 12 FFC 1.2V_Power On Reset_POR12, IO voltage=1.2V
- TSMC 12 FFC 1.8V_Power On Reset_POR18, IO voltage=1.8V
- ONFI 4.1 NAND Flash Controller & PHY & IO Pads on 16nm
- ONFI 4.1 NAND Flash Controller & PHY & IO Pads on 12nm
- ONFI 4.1 NAND Flash Controller & PHY & IO Pads on 28nm