MIPI C-PHY v1.2 D-PHY v2.1 TX 3 trios/4 Lanes in TSMC (16nm, N7, N5A)
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DDR3 Combo PHY Data Block for solder bump application; UMC 40nm LP/RVT Logic Process
DDR3 Combo PHY Data Block for solder bump application; UMC 40nm LP/RVT Logic Process
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Interface Solution IP
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