D2D UCIe

The Die-to-Die interface is a functional block that provides a data interface between two chip dies within the same package. MSquare's D2D solution, compatible with the UCIe v1.1 specification, includes both a Die-to-Die adapter layer and a physical layer. Each layer features a sideband interface that provides a back-channel for link training and access to the registers of the link partner, as shown in Figure 1. This unique hybrid analog/digital architecture offers low power consumption, compact footprint, and robust performance, making it well-suited for target applications such as high-performance computing, AI, or multimedia SoCs, and Die-to-Die interconnections.

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