Digital Power Grid Overlay -- 20% to 40% Total Digital Dynamic Power Reduction
Bluetooth LE v5.3 / Zigbee 3 RF/PHY for Global Foundry 55nm(经过硅验证的 IP)
查看 Bluetooth LE v5.3 / Zigbee 3 RF/PHY for Global Foundry 55nm(经过硅验证的 IP) 详细介绍:
- 查看 Bluetooth LE v5.3 / Zigbee 3 RF/PHY for Global Foundry 55nm(经过硅验证的 IP) 完整数据手册
- 联系 Bluetooth LE v5.3 / Zigbee 3 RF/PHY for Global Foundry 55nm(经过硅验证的 IP) 供应商
Block Diagram of the Bluetooth LE v5.3 / Zigbee 3 RF/PHY for Global Foundry 55nm(经过硅验证的 IP)
ULP IP
- TESIC RISC-V CC EAL5+ Secure Element Soft/Hard Macro
- Duet Package of Embedded Memories and Logic Libraries for UMC (40nm, 28nm)
- Bluetooth Dual Mode v5.4 / IEEE 15.4 PHY/RF IP in TSMC22nm ULP
- TESIC CC EAL5+ Secure Element IP Core
- BLE v5.3 / IEEE 15.4 PHY/RF IP in TSMC22 ULP
- Ultra-low-power 12-bit SAR ADC with lowest voltage