GF 22nm 中的蓝牙双模 v5.3 / IEEE 15.4 PHY/RF IP(硅验证)
这种双模射频IP是迄今为止最低的功耗(<3mW),以及最先进的性能(灵敏度、干扰抑制)和最低的成本。由于其内置的LDO、完全可编程的调制解调器以及与领先的BT基带控制器兼容的接口,这款双模RF IP经过优化,易于集成到ASIC和SoC中.
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Block Diagram of the GF 22nm 中的蓝牙双模 v5.3 / IEEE 15.4 PHY/RF IP(硅验证)
Bluetooth dual mode IP
- Ceva-Waves Bluetooth 5.4 dual mode Baseband Controller
- Bluetooth Dual Mode v5.4 / IEEE 15.4 PHY/RF IP in TSMC22nm ULP
- Ceva-Waves Bluetooth 5.3 dual mode Baseband Controller
- Multi-protocol wireless plaform integrating 802.11ax (Wi-Fi 6), Bluetooth 5.4 Dual Mode, 802.15.4 (for Thread, Zigbee and Matter)
- Bluetooth Dual Mode (Classic & BLE ) v5.3 Protocol Software Stack and Profiles IP
- Bluetooth Dual Mode (Classic & BLE ) v5.0 Protocol Software Stack and Profiles IP