BLE v5.0 RF PHY KGD 和 IP
集成的BLE链路层能够支持2Mbps的蓝牙数据速率,实现高速和长距离蓝牙连接,连接范围约为100米.
与MCU芯片或SOC芯片的连接、与集成AES数据加密解密引擎的连接,均可通过标准SPI接口配合片选及分组同步管脚完成,整个方案不需要额外RAM、ROM或闪存等存储器件的支持.
这个设计集成到任何一种规格的嵌入式MCU系统.
Availability
封装射频芯片
已知良好模具(KGD):与SIP中的微控制器堆叠
RF IP:GDSII,技术转让
产线转移
一站式ASIC设计服务:采用核心蓝牙IP,设计相关的蓝牙芯片
查看 BLE v5.0 RF PHY KGD 和 IP 详细介绍:
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Block Diagram of the BLE v5.0 RF PHY KGD 和 IP
Bluetooth IP
- Bluetooth low energy v5.4 Baseband Controller, Protocol Software Stack and Profiles IP
- Ceva-Waves Bluetooth 5.4 Low Energy Baseband Controller / Link Layer, software and profiles
- Bluetooth 5.4 LE Controller with Link Layer, optional 802.15.4 MAC, early access to Channel Sounding
- Ceva-Waves Bluetooth 5.3 Low Energy Baseband Controller, software and profiles
- Multi-protocol wireless plaform integrating 802.11ax (Wi-Fi 6), Bluetooth 5.4 Dual Mode, 802.15.4 (for Thread, Zigbee and Matter)
- Bluetooth Dual Mode v5.4 / IEEE 15.4 PHY/RF IP in GF 22nm (Silicon Proven)