A Wirebond and FlipChip compatible <80fF ESD Solutions for Multi-Gigabit SerDes Applications.

This silicon-proven TSMC 28nm Digital I/O Library delivers a low-capacitance, high-reliability interface solution optimized for advanced semiconductor applications. Featuring low-capacitance LVDS differential pairs (<250fF per pin) at 0.8V, this library ensures superior signal integrity for high-speed applications. The I/O macro seamlessly integrates with the TSMC 1.0V I/O Library, sharing a compatible VDDA and VSSA bus structure for streamlined power management. Designed with a 14-bondpad ESD macro, including two differential pairs and dedicated power/ground cells, it provides a robust 0.8V VDDA power domain with a 0V ground reference. Engineered for reliability, the library avoids minimum-width metal traces and adheres to enhanced via/contact recommendations for long-term durability. With Cadence OA database compatibility, the library supports Spectre and auCdl views, enabling seamless simulation, LVS verification, and integration into standard design flows.

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