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16G UCIe Advanced PHY for TSMC N3P
UCIe enables chiplet industry standard interoperability combined with ultra-low latency, extreme power efficiency, and high performance
The Cadence® UCIe IP complete solution meets the growing demand for high performance and bandwidth, superior power efficiency, and ultra-low latency interconnect between dies on different foundries and process nodes.
The Cadence® UCIe IP complete solution meets the growing demand for high performance and bandwidth, superior power efficiency, and ultra-low latency interconnect between dies on different foundries and process nodes.
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