Arteris IP在2018年增加了20个授权并发布了3个新产品

Network-on-Chip (NoC) semiconductor IP growth driven by customer development of new automotive, machine learning & data center systems-on-chip (SoCs)

CAMPBELL, Calif. – January 29, 2019 – Arteris IP, the world’s leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that the company added 20 new licensees for its Arteris IP Ncore^®, FlexNoC^®, CodaCache™, AI Package and PIANO^® Interconnect IP products. Publicly announced Arteris customers added during 2018 include Baidu, Arbe Robotics, AutoChips, AutoTalks, Canaan Creative, Enflame Technology, Iluvatar CoreX, and thirteen as yet undisclosed licensees. This is the highest number of new licensees added in one year in Arteris IP history.

In addition to these new customers, Arteris IP received several renewal license contracts including ones from Mobileye and VeriSilicon. The company also celebrated signing its 100^th NoC IP licensee in June.

Arteris IP customers successfully taped-out numerous leading-edge SoCs including multiple automotive autonomous driving and ADAS SoCs in the latest 7nm semiconductor process technologies. The total unit volume of SoCs shipped with Arteris IP interconnect products now exceeds 2.5 Billion units, proving the quality and effectiveness of Arteris NoC interconnect technology.

As the number one on-chip interconnect IP company, Arteris IP is also the world’s leading investor in NoC research and development. The fruits of Arteris IP R&D investments resulted in the delivery of several new interconnect IP products in 2018:

• Artificial Intelligence (AI) Package, an add-on option to FlexNoC 4, implements many new technologies that ease the development of today’s most complex AI, deep neural network (DNN), and autonomous driving systems-on-chip (SoC)
• CodaCache independent last level cache for latency reduction and memory bandwidth optimization in for high-performance systems-on-chip (SoCs)
• FlexNoC 4.0 interconnect IP, offering performance and feature benefits for all FlexNoC users
• Ncore Cache Coherent Interconnect IP version 2.5 and 2.6 releases with new Fast SystemC modeling, performance improvements and customer-requested enhancements
• PIANO Timing Closure Package version 2.3 with interconnect timing closure estimation and critical path latency optimization.

Regarding organizational growth, Arteris IP expanded its Greater China sales and support organization, including the addition of Jay Chiang as President of Greater China and multiple sales people and application engineers in China. Arteris IP also strengthened its management team with the addition of Khaled Labib as Vice President of Engineering.

“In 2018, Arteris IP’s focus on automotive and artificial intelligence markets paid off with the highest number of new Arteris IP customers in history selecting our interconnect IP technology.” said K. Charles Janac, President and CEO of Arteris IP. “This high rate of customer adoption allows us to invest more than any other company in the on-chip interconnect technologies needed for tomorrow’s SoC applications for artificial intelligence and machine learning, automated driving and data center acceleration. Arteris IP is committed to deliver the most sophisticated NoC interconnect IP technologies in the industry backed by the world’s most experienced global support organization.”

About Arteris IP

Arteris IP provides network-on-chip (NoC) interconnect IP to accelerate system-on-chip (SoC) semiconductor assembly for a wide range of applications from AI to automobiles, mobile phones, IoT, cameras, SSD controllers, and servers for customers such as Samsung, Huawei / HiSilicon, Mobileye, and Texas Instruments. Arteris IP products include the Ncore cache coherent and FlexNoC non-coherent interconnect IP, the CodaCache standalone last level cache, and optional Resilience Package (ISO 26262 functional safety), FlexNoC AI Package, and PIANO automated timing closure capabilities. Customer results obtained by using Arteris IP products include lower power, higher performance, more efficient design reuse and faster SoC development, leading to lower development and production costs. For more information, visit www.arteris.com.