Rambus与Winbond签署专利许可协议

Broad agreement addresses device and cloud demands for high bandwidth, low latency, efficient memory solutions

SUNNYVALE, Calif. – January 16, 2017 – Rambus Inc. (NASDAQ:RMBS) today announced it has signed a broad five-year patent license agreement with Winbond Electronics Corporation, a worldwide leading supplier of specialty memory. This agreement covers the use of Rambus patented memory solutions, including server DIMM chipsets, for Winbond products through 2021.

“In today’s data intensive applications, computing memory solutions must be more efficient, deliver higher levels of bandwidth and lower latency to solutions to meet the demands of the market,” said Luc Seraphin, general manager of the Interface Division at Rambus. “This collaborative partnership with Winbond provides critical memory and interface technologies that address the needs and requirements to run effective data centers.”

Rambus develops high-performance, low-power memory and SerDes interface chips and IP cores to meet the needs of increasingly diverse enterprise and mobile applications. Rambus also drives innovations in silicon-to-cloud security, making digital products safer and better.

For additional information on Rambus products and solutions, please visit rambus.com.

About Rambus Inc.
Rambus creates innovative hardware and software technologies, driving advancements from the data center to the mobile edge. Our chips, customizable IP cores, architecture licenses, tools, software, services, training and innovations improve the competitive advantage of our customers. We collaborate with the industry, partnering with leading ASIC and SoC designers, foundries, IP developers, EDA companies and validation labs. Our products are integrated into tens of billions of devices and systems, powering and securing diverse applications, including Big Data, Internet of Things (IoT), mobile, consumer and media platforms. At Rambus, we are makers of better. For more information, visit rambus.com.

About Winbond Electronics Corp.
Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions, headquartered in Taichung, Taiwan. Winbond’s major products include Specialty DRAM, Mobile DRAM, and Code Storage Flash Memory with Winbond’s memory business revenues in 2015 close to US$1 billion. Winbond has approximately 2,700 employees worldwide, with offices in Taiwan, Hong Kong, China, Japan, Israel, and the USA. For more information, please visit winbond.com.