Tensilica Vision Q7 DSP
LC3plus Audio Codec IP for Bluetooth LE Audio
NVM EEPROM NeoEE in Samsung (180nm, 130nm)
USB 2.0 nanoPHY in TSMC (65nm, 55nm, 40nm)
SiFive 推出 Intelligence XM 系列加速 AI 处理，并阐述推动 RISC-V 在 AI 领域应用的关键拐点
MIPI联盟发布A-PHY v2.0，将汽车SerDes接口的最大数据速率翻倍以支持新兴的车辆架构
EnSilica加入台积电设计中心联盟
Creating SoC Designs Better and Faster With Integration Automation
现代系统中的 8051：与 AMBA 总线接口
Time Sensitive Networking for Aerospace
The Ultimate CPU: Arm Cortex-X925's Breakthrough with a 15 Percent IPC Improvement
How to Secure Your Computing System's Power-Up Process with Secure Boot?
Locking When Emulating Xtensa LX Multi-Core on a Xilinx FPGA
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